Understanding 3D AOI, What It Is, and What It Isn’t - Circuits …
WEBDec 1, 2013 — Figure 5. The same part in 3D. Currently, AOI systems come with different levels of 3D coverage for components and solder joints. All 3D systems still offer 2D lighting and 2D inspection. It is for the AOI programmer or the QA department to decide to what extent they’d like to deploy new technology for quality assurance.
Neways to Construct EMS Factory in Slovakia - Circuits Assembly
WEBApr 12, 2022 — by Chelsey Drysdale. NOVA DUBNICA, SLOVAKIA – Neways said it plans to replace its two electronics manufacturing sites in Slovakia with one new 16,000 sq. m. factory, according to reports. The new site will focus on PCB, cable harnesses and cabinet production. The company says the facility will potentially grow to …
The Future of Through-Hole Technology - Circuits Assembly
WEBThrough-hole technology is a process by which a plated through-hole (PTH) component is soldered into drilled holes on a printed circuit board (PCB). Through-hole technology was dominant for years in electronics assembly until surface mount technology became available in the 1980s. Today, the majority of components in a product are surface-mount ...
Circuits Assembly Online Magazine - Home
WEBPEACHTREE CITY, GA – The Printed Circuit Engineering Association and JITX today announced the printed circuit board design industry’s first ... Kitron Lowers 2024 Revenue Outlook. BILLINGSTAD, NORWAY – Kitron has lowered its revenue forecast for the second half of 2024 after a reduction in orders from customers.
WEBThis amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
Koh Young Debuts Zenith Alpha 3-D AOI - Circuits Assembly
WEBPublished: 03 October 2019. Zenith Alpha 3-D automated optical inspection (AOI) incorporates a “Smart and Dynamic” feature set, plus quality optimization technologies. Collects, analyzes and manages data in real-time to dynamically formulate a multifaced view of the assembly process. Provides reliable 3 …
ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software
WEBM.O.L.E. MAP 3.00 software is designed for machine-assembly-process optimization. Switches from one application to the next, transitioning between wave soldering and reflow processes. Integrates with all ECD profiling hardware. Can use ECD sensor inputs to ECD M.O.L.E. thermal profilers. Start wizards provide step-by-step guidance for new ...
Alpha Assembly Solutions Achieves IATF 16949 Certification
WEBNov 16, 2018 — by Chelsey Drysdale. Somerset, NJ – November 16, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has attained International Automotive Task Force (IATF) 16949:2016 certification for all manufacturing facilities globally that produce products for automotive applications ...
Connecting the Dots: Lean and Field Service
WEBJan 3, 2022 — In a normal business environment, the electronics manufacturing services (EMS) industry has more variation than that of a Lean original equipment manufacturer (OEM). This doesn’t mean EMS providers are disorganized. It simply highlights the challenges of an environment where customer inputs dictate supply-chain choices, processes and validation methodologies that would normally be optimized ...
WEBFor CSP and BGA encapsulation, the proper underfill encapsulant must be easy to handle and process, and must yield void-free encapsulation. Properties such as storage conditions, pot life, dispensability, underfill flow speed and cure time. 1: The ideal underfill flow front (left) is flat and smooth, while a poor flow front (right) can have ...